28.01.99 ? by semikron skiip 832 gb 120 - 406 ctv absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 3000 v t op ,t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 1200 v v cc 5) operating dc link voltage 900 v i c igbt 800 a t j 3) igbt + diode -40...+150 c i f diode 800 a i fm diode, t p < 1 ms 1600 a i fsm diode, t j = 150 c, 10ms; sin 5760 a i 2 t (diode) diode, t j = 150 c, 10ms 166 kas 2 driver v s1 stabilized power s upply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 19 khz dv/dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt 11) v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 40 1,2 - ma ma v to t j = 125 c -- 1,38 v r t t j = 125 c -- 2,6 m w v cesat i c = 700a, t j = 125 c -- 3,2 v v cesat i c = 700a, t j = 25 c -- 3,05 v e on + e off v cc =600/900v,i c =800a t j = 125 c -- 240/390 mj c chc per skiip, ac side - 4,2 - nf l ce top, bottom - 5 - nh inverse diode 2) v f = v ec i f = 700a; t j = 125 c -- 2,45 v v f = v ec i f = 700a; t j = 25 c -- 2,55 v e on + e off i f = 800a; t j = 125 c -- 32 mj v to t j = 125 c - 0,91 - v r t t j = 125 c - 1,4 - m w thermal characteristics r thjs 10) per igbt -- 0,032 c/w r thjs 10) per diode -- 0,094 c/w r thsa 6,10) p16 heatsink; see case s4 -- 0,033 c/w driver i s1 supply current 15v-supply 290+550*f s /f smax +1,3*i ac /a ma i s2 supply current 24v-supply 220+400*f s /f smax +1,0*i ac /a ma t interlock-driver interlock-time 3,3 s skiippack protection i tripsc short circuit protection 1000 2% a i triplg ground fault protection - a t trip over-temp. protection 115 5% c u dctrip 9) u dc -protection 920 2% v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack halfbridge skiip 832 gb 120 - 406 ctv 7,9) preliminary data case s4 features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capab ility, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link/ ac output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 8) ac connection busbars must be connected by the user; copper busbars available on request 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor 11) npt-technology with homo- genous current-distribution
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